<?xml version="1.0" encoding="UTF-8"?>
<xml>
  <records>
    <record>
       <contributors>
          <authors>
             <author>Helsper, J.</author>
             <author>Kazakov, S.</author>
             <author>Longuevergne, D.</author>
             <author>Passarelli, D.</author>
             <author>Solyak, N.</author>
             <author>Wallon, S.</author>
          </authors>
       </contributors>
       <titles>
          <title>
             Design, Manufacturing, Assembly, and Lessons Learned of the Pre-Production 325 MHz Couplers for the PIP-II Project at Fermilab
          </title>
       </titles>
       <publisher>JACoW Publishing</publisher>
       <pub-location>Geneva, Switzerland</pub-location>
		 <isbn>2673-5504</isbn>
		 <isbn>978-3-95450-234-9</isbn>
		 <electronic-resource-num>10.18429/JACoW-SRF2023-WEPWB094</electronic-resource-num>
		 <language>English</language>
		 <pages>806-811</pages>
       <keywords>
          <keyword>vacuum</keyword>
          <keyword>cavity</keyword>
          <keyword>SRF</keyword>
          <keyword>interface</keyword>
          <keyword>cryomodule</keyword>
       </keywords>
       <work-type>Contribution to a conference proceedings</work-type>
       <dates>
          <year>2023</year>
          <pub-dates>
             <date>2023-09</date>
          </pub-dates>
       </dates>
       <urls>
          <related-urls>
              <url>https://doi.org/10.18429/JACoW-SRF2023-WEPWB094</url>
              <url>https://jacow.org/srf2023/papers/wepwb094.pdf</url>
          </related-urls>
       </urls>
       <abstract>
          Five 325 MHz high-power couplers will be integrated into the pre-production Single Spoke Resonator Type-II (ppSSR2) cryomodule for the PIP-II project at Fermilab. Couplers were procured by both Fermilab and IJCLAB for this effort. The design of the coupler is described, including design optimizations from the previous generation. This paper then describes the coupler life cycle, including design, manufacturing, and assembly, along with the lessons learned at each stage.
       </abstract>
    </record>
  </records>
</xml>
