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'Journal of Accelerator Conferences Website' (JACoW) is a publisher in Geneva, Switzerland that publishes the proceedings of accelerator conferences held around the world by an international collaboration of editors.


https://doi.org/10.18429/JACoW-SRF2021-WEPCAV002
Title Improvement of Chemical Etching Capabilities (BCP) for SRF Spoke Resonators at IJCLab
Authors
  • J. Demercastel-Soulier, P. Duchesne, D. Longuevergne, G. Olry, T. Pépin-Donat, F. Rabehasy, D. Reynet, S. Roset, L.M. Vogt
    Université Paris-Saclay, CNRS/IN2P3, IJCLab, Orsay, France
Abstract Buffered chemical polishing (BPC) is the reference surface polishing adopted for ESS and MYRRHA SRF spoke resonators at IJCLab. This chemical treatment, in addition to improving the RF performance, fits into the frequency adjustment strategy of the jacketed cavity during its preparation phase. In the framework of the collaboration with Fermilab for PIP-II project, IJCLab has developed a new setup to perform rotational BCP. The implementation of a rotation during chemical etching improves significantly the homogeneity and quality of surface polishing. In this paper, we present the numerical analysis based on a fluid dynamics model. The goal is to estimate the acid flow characteristics inside the cavity, determine the influence of several parameters as mass flow rate and rotation speed and propose the best configuration for the new experimental setup
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Conference SRF2021
Series International Conference on RF Superconductivity (20th)
Location East Lansing, MI, USA
Date 28 June-02 July 2021
Publisher JACoW Publishing, Geneva, Switzerland
Editorial Board Kenji Saito (FRIB, MSU, East Lansing, MI, USA); Ting Xu (FRIB, MSU, East Lansing, MI, USA); Naruhiko Sakamoto (RIKEN, Wako, Japan); Ana Lesage (FRIB, MSU, East Lansing, MI, USA); Volker R.W. Schaa (GSI, Darmstadt, Germany)
Online ISBN 978-3-95450-233-2
Online ISSN 2673-5504
Received 23 June 2021
Revised 18 August 2021
Accepted 21 August 2021
Issue Date 14 January 2022
DOI doi:10.18429/JACoW-SRF2021-WEPCAV002
Pages 590-593
Copyright
Creative Commons CC logoPublished by JACoW Publishing under the terms of the Creative Commons Attribution 4.0 International license. Any further distribution of this work must maintain attribution to the author(s), the published article's title, publisher, and DOI.