'Journal of Accelerator Conferences Website' (JACoW) is a publisher in Geneva, Switzerland that publishes the proceedings of accelerator conferences held around the world by an international collaboration of editors.
| Title | Improvement of Chemical Etching Capabilities (BCP) for SRF Spoke Resonators at IJCLab | |
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| Abstract | Buffered chemical polishing (BPC) is the reference surface polishing adopted for ESS and MYRRHA SRF spoke resonators at IJCLab. This chemical treatment, in addition to improving the RF performance, fits into the frequency adjustment strategy of the jacketed cavity during its preparation phase. In the framework of the collaboration with Fermilab for PIP-II project, IJCLab has developed a new setup to perform rotational BCP. The implementation of a rotation during chemical etching improves significantly the homogeneity and quality of surface polishing. In this paper, we present the numerical analysis based on a fluid dynamics model. The goal is to estimate the acid flow characteristics inside the cavity, determine the influence of several parameters as mass flow rate and rotation speed and propose the best configuration for the new experimental setup | |
| Paper | download WEPCAV002.PDF [1.694 MB / 4 pages] | |
| Cite | download ※ BibTeX ※ LaTeX ※ Text/Word ※ RIS ※ EndNote | |
| Conference | SRF2021 | |
| Series | International Conference on RF Superconductivity (20th) | |
| Location | East Lansing, MI, USA | |
| Date | 28 June-02 July 2021 | |
| Publisher | JACoW Publishing, Geneva, Switzerland | |
| Editorial Board | Kenji Saito (FRIB, MSU, East Lansing, MI, USA); Ting Xu (FRIB, MSU, East Lansing, MI, USA); Naruhiko Sakamoto (RIKEN, Wako, Japan); Ana Lesage (FRIB, MSU, East Lansing, MI, USA); Volker R.W. Schaa (GSI, Darmstadt, Germany) | |
| Online ISBN | 978-3-95450-233-2 | |
| Online ISSN | 2673-5504 | |
| Received | 23 June 2021 | |
| Revised | 18 August 2021 | |
| Accepted | 21 August 2021 | |
| Issue Date | 14 January 2022 | |
| DOI | doi:10.18429/JACoW-SRF2021-WEPCAV002 | |
| Pages | 590-593 | |
| Copyright |
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