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https://doi.org/10.18429/JACoW-SRF2021-MOPFDV001
Title Investigation of an Alternative Path for SRF Cavity Fabrication and Surface Processing
Authors
  • O. Hryhorenko, D. Longuevergne
    Université Paris-Saclay, CNRS/IN2P3, IJCLab, Orsay, France
  • C.Z. Antoine
    CEA-IRFU, Gif-sur-Yvette, France
  • F. Brisset
    ICMMO, Orsay, France
  • T. Dohmae
    KEK, Ibaraki, Japan
Abstract The preparation of SRF cavities includes a lengthy, costly, and safety issued electrochemical polishing (EP or BCP) step to remove the damaged layer coming from the cavity fabrication. We have shown that most of the damage layer is originated from the rolling process during the preparation of the sheet material, while subsequent deep drawing tends to leave only µm thick damage layer. We propose a 2-steps mechanical process that allows us to easily get rid of the thick damage layer on the sheets before cavity forming. The process has been established on samples and extended to large disks ready for 1.3 GHz half-cell forming. The polished sheets will be then sent to KEK for half-cell forming and subsequent surface and material analysis before proceeding to half-cell welding. Former studies on the sample demonstrated that damages induced by forming can successfully be removed by recrystallization and less than 10 µm final chemistry.
Paper download MOPFDV001.PDF [2.262 MB / 4 pages]
Poster download MOPFDV001_POSTER.PDF [2.309 MB]
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Conference SRF2021
Series International Conference on RF Superconductivity (20th)
Location East Lansing, MI, USA
Date 28 June-02 July 2021
Publisher JACoW Publishing, Geneva, Switzerland
Editorial Board Kenji Saito (FRIB, MSU, East Lansing, MI, USA); Ting Xu (FRIB, MSU, East Lansing, MI, USA); Naruhiko Sakamoto (RIKEN, Wako, Japan); Ana Lesage (FRIB, MSU, East Lansing, MI, USA); Volker R.W. Schaa (GSI, Darmstadt, Germany)
Online ISBN 978-3-95450-233-2
Online ISSN 2673-5504
Received 25 June 2021
Revised 11 July 2021
Accepted 21 August 2021
Issue Date 15 May 2022
DOI doi:10.18429/JACoW-SRF2021-MOPFDV001
Pages 319-322
Copyright
Creative Commons CC logoPublished by JACoW Publishing under the terms of the Creative Commons Attribution 4.0 International license. Any further distribution of this work must maintain attribution to the author(s), the published article's title, publisher, and DOI.