Electrochemical Deposition of  Nb₃Sn on the Surface of Cu Substrates

Lu, Ming; Chu, Qingwei; He, Yuan; Lin, Zeqiang; Pan, Feng; Tan, Teng; Yang, Ziqin

doi:10.18429/JACoW-SRF2019-TUP076

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LaTeX citation export for TUP076: Electrochemical Deposition of Nb₃Sn on the Surface of Cu Substrates

%\cite{lu:srf2019-tup076}
\bibitem{lu:srf2019-tup076}
   M. Lu, Q.W. Chu, Y. He, Z.Q. Lin, F. Pan, T. Tan, and \emph{et al.},
%   M. Lu, Q.W. Chu, Y. He, Z.Q. Lin, F. Pan, T. Tan, and Z.Q. Yang,
%   M. Lu \emph{et al.},
   \textquotedblleft{Electrochemical Deposition of  Nb₃Sn on the Surface of Cu Substrates}\textquotedblright,
% --- abbreviated form (published paper) - JACoW template Feb 2018 ---
   in \emph{Proc. SRF'19}, Dresden, Germany, Jun.-Jul. 2019, pp. 624--627.
   \url{doi:10.18429/JACoW-SRF2019-TUP076}
% --- additional material -ISSN/ISBN--
%  ISBN: 978-3-95450-211-0, ISSN: ""