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https://doi.org/10.18429/JACoW-SRF2019-TUP028
Title Development of Vertical Electropolishing Facility for Nb 9-Cell Cavity (3)
Authors
  • Y.I. Ida, V. Chouhan, K.N. Niipresenter
    MGH, Hyogo-ken, Japan
  • T. Akabori, G. Mitoya, K. Miyano
    HKK, Morioka, Japan
  • Y. Anetai, F. Takahashi
    WING. Co.Ltd, Iwate-ken, Japan
  • H. Hayano, S. Kato, H. Monjushiro, T. Saeki, M. Sawabe
    KEK, Ibaraki, Japan
Abstract The 1st report was delivered in May, 2018 at the IPAC 18 in Vancouver, Canada. The 2nd report was delivered in September, 2018 at the LINAC 18 in Beijing, China. We will make our 3rd report in July, 2019 at the SRF-19 in Dresden, Germany. There will be two main points this time. The first is that by using our improved Ninja Electrode Premium, we can out-perform our number one and number two competitors in terms of uniform electropolishing of the interior of the 9-cell cavity. The second point is that we can remove hydrogen gas, reacted during electropolishing, from the cavity chambers in a manner that has not been successfully achieved by 1st report, May 2018 and 2nd report, September 2018. We will report our 9-cell vertical polishing revolver-type unit that solves the above two problems.
Paper download TUP028.PDF [0.792 MB / 2 pages]
Poster download TUP028_POSTER.PDF [0.444 MB]
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Conference SRF2019
Series International Conference on RF Superconductivity (19th)
Location Dresden, Germany
Date 30 June-05 July 2019
Publisher JACoW Publishing, Geneva, Switzerland
Editorial Board Peter Michel (HZDR, Dresden, Germany); André Arnold (HZDR, Dresden, Germany); Volker RW Schaa (GSI, Darmstadt, Germany)
Online ISBN 978-3-95450-211-0
Online ISSN ""
Received 24 June 2019
Accepted 29 June 2019
Issue Date 14 August 2019
DOI doi:10.18429/JACoW-SRF2019-TUP028
Pages 470-471
Copyright
Creative Commons CC logoPublished by JACoW Publishing under the terms of the Creative Commons Attribution 3.0 International license. Any further distribution of this work must maintain attribution to the author(s), the published article's title, publisher, and DOI.