| Title |
Vibro-tumbling as an Alternative to Standard Mechanical Polishing Techniques for SRF Cavities |
| Authors |
- E. Chyhyrynets, O. Azzolini, V.A. Garcia, G. Keppel, C. Pirapresenter, F. Stivanello, L. Zanotto
INFN/LNL, Legnaro (PD), Italy
|
| Abstract |
Centrifugal Barrel Polishing (CBP) is a common tool in the Nb bulk SC cavities production, prior to elec-tropolishing (EP). Indeed, the mechanical polishing is fun-damental also in the superconducting thin film resonant cavities in which one of the main issues that limits the per-formances is the surface preparation. A promising vi-bro-tumbling technique is being studied and implemented with a possibility to replace or improve mechanical treat-ment steps (grinding, barrel polishing). The simplic-ity of the technology allows it to adapt to any cavity geom-etry, both for Nb and Cu materials. The presented work contains last results on 6 GHz cavities obtained at LNL-INFN, both Nb bulk and Cu cavities.
|
| Funding |
Work supported by the INFN V group experiment TEFEN, Agreement N. KE2722/BE/FCC and from the European Union’s H2020 Framework Programme under grant agreement no. 764879 (EASITrain) |
| Paper |
download TUP026.PDF [0.723 MB / 3 pages] |
| Poster |
download TUP026_POSTER.PDF [5.584 MB] |
| Export |
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※ EndNote |
| Conference |
SRF2019 |
| Series |
International Conference on RF Superconductivity (19th) |
| Location |
Dresden, Germany |
| Date |
30 June-05 July 2019 |
| Publisher |
JACoW Publishing, Geneva, Switzerland |
| Editorial Board |
Peter Michel (HZDR, Dresden, Germany); André Arnold (HZDR, Dresden, Germany); Volker RW Schaa (GSI, Darmstadt, Germany) |
| Online ISBN |
978-3-95450-211-0 |
| Online ISSN |
"" |
| Received |
21 June 2019 |
| Accepted |
30 June 2019 |
| Issue Date |
14 August 2019 |
| DOI |
doi:10.18429/JACoW-SRF2019-TUP026 |
| Pages |
464-466 |
| Copyright |
 Published by JACoW Publishing under the terms of the Creative Commons Attribution 3.0 International license. Any further distribution of this work must maintain attribution to the author(s), the published article's title, publisher, and DOI. |
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