JACoW logo

Joint Accelerator Conferences Website

The Joint Accelerator Conferences Website (JACoW) is an international collaboration that publishes the proceedings of accelerator conferences held around the world.


https://doi.org/10.18429/JACoW-SRF2019-THP089
Title Development of Superconducting RF Double Spoke Cavity at IHEP
Authors
  • Q. Zhou, F.S. He, W.M. Pan
    IHEP, Beijing, People’s Republic of China
Abstract The China Spallation Neutron Source (CSNS) is de-signed to produce spallation neutrons. CSNS upgrade is planned to increase beam power by inserting a SRF linac after drift tube linac (DTL). IHEP is developing a 325MHz double spoke cavity at ¿0 of 0.5 for the CSNS SRF linac. The cavity shape was optimized to minimize Ep/Ea while keeping Bp/Ep reasonably low. Meanwhile, mechanical design was applied to check stress, Lorentz force detuning and microphonic effects, and to minimize pressure sensitivity. A new RF coupling scheme was pro-posed to avoid electrons hitting directly on ceramic win-dow. After fabrication and post processing of cavity, the cavity reached Bp of 120mT at E_{acc} = 13.8MV/m and Q₀ = 1.72·10¹⁰ under vertical test at 2K.
Paper download THP089.PDF [2.327 MB / 6 pages]
Poster download THP089_POSTER.PDF [2.176 MB]
Export download ※ BibTeX LaTeXText/WordRISEndNote
Conference SRF2019
Series International Conference on RF Superconductivity (19th)
Location Dresden, Germany
Date 30 June-05 July 2019
Publisher JACoW Publishing, Geneva, Switzerland
Editorial Board Peter Michel (HZDR, Dresden, Germany); André Arnold (HZDR, Dresden, Germany); Volker RW Schaa (GSI, Darmstadt, Germany)
Online ISBN 978-3-95450-211-0
Online ISSN ""
Received 22 June 2019
Accepted 30 June 2019
Issue Date 14 August 2019
DOI doi:10.18429/JACoW-SRF2019-THP089
Pages 1114-1119
Copyright
Creative Commons CC logoPublished by JACoW Publishing under the terms of the Creative Commons Attribution 3.0 International license. Any further distribution of this work must maintain attribution to the author(s), the published article's title, publisher, and DOI.