JACoW logo

Joint Accelerator Conferences Website

The Joint Accelerator Conferences Website (JACoW) is an international collaboration that publishes the proceedings of accelerator conferences held around the world.


https://doi.org/10.18429/JACoW-NAPAC2019-TUPLM24
Title Electron Heating by Ions in Cooling Rings
Authors
  • H. Zhao, M. Blaskiewicz
    BNL, Upton, New York, USA
Abstract Hadron beam cooling at high energy is a critical technique for Electron-Ion Colliders (EIC). We consider using an electron storage ring for the EIC at BNL. For such a cooler, the electron beam quality plays an important role since it directly determines the cooling rate. Besides the effects of IBS, space charge and synchrotron damping, which are calculable with well known methods, the heating effect by ions also needs to be carefully considered in electron beam dynamics. In this paper, we present an analytical model to calculate the heating rate by ions and give some example calculations. In addition, this model was benchmarked by applying it on the IBS calculation.
Footnotes & References * Work supported by States Department of Energy
Paper download TUPLM24.PDF [0.382 MB / 4 pages]
Export download ※ BibTeX LaTeXText/WordRISEndNote
Conference NAPAC2019
Series North American Particle Accelerator Conference (4th)
Location Lansing, MI, USA
Date 01-06 September 2019
Publisher JACoW Publishing, Geneva, Switzerland
Editorial Board Yoshishige Yamazaki (MSU, East-Lansing, MI, USA); Tor Raubenheimer (SLAC, Stanford, CA, USA); Amy McCausey (FRIB, East-Lansing, MI, USA); Volker RW Schaa (GSI, Darmstadt, Germany)
Online ISBN 978-3-95450-223-3
Online ISSN 2673-7000
Received 26 August 2019
Accepted 02 September 2019
Issue Date 08 October 2019
DOI doi:10.18429/JACoW-NAPAC2019-TUPLM24
Pages 426-429
Copyright
Creative Commons CC logoPublished by JACoW Publishing under the terms of the Creative Commons Attribution 3.0 International license. Any further distribution of this work must maintain attribution to the author(s), the published article's title, publisher, and DOI.