<xml>
  <records>
    <record>
       <contributors>
          <authors>
             <author>Shiroyanagi, Y.</author>
             <author>Fuerst, J.D.</author>
             <author>Hasse, Q.B.</author>
             <author>Ivanyushenkov, Y.</author>
          </authors>
       </contributors>
       <titles>
          <title>
             Thermal Modeling and Cryogenic Design of a Helical Superconducting Undulator Cryostat
          </title>
       </titles>
		 <publisher>JACoW</publisher>
       <pub-location>Geneva, Switzerland</pub-location>
		 <isbn>978-3-95450-180-9</isbn>
		 <electronic-resource-num>10.18429/JACoW-NAPAC2016-THA1CO05</electronic-resource-num>
		 <language>English</language>
		 <pages>1064-1067</pages>
       <pages>THA1CO05</pages>
       <keywords>
          <keyword>ion</keyword>
          <keyword>cryogenics</keyword>
          <keyword>undulator</keyword>
          <keyword>operation</keyword>
          <keyword>radiation</keyword>
       </keywords>
       <work-type>Contribution to a conference proceedings</work-type>
       <dates>
          <year>2017</year>
          <pub-dates>
             <date>2017-01</date>
          </pub-dates>
       </dates>
       <urls>
          <related-urls>
              <url>http://dx.doi.org/10.18429/JACoW-NAPAC2016-THA1CO05</url>
              <url>https://jacow.org/napac2016/papers/tha1co05.pdf</url>
          </related-urls>
       </urls>
       <abstract>
          A conceptual design for a helical superconducting undulator (HSCU) for the Advanced Photon Source (APS) at Argonne National Laboratory (ANL) has been completed. The device differs sufficiently from the existing APS planar superconducting undulator (SCU) design to warrant development of a new cryostat based on value engineering and lessons learned from the existing planar SCU. Changes include optimization of the existing cryocooler-based refrigeration system and thermal shield as well as cost reduction through the use of standard vacuum hardware. The end result is a design that provides significantly larger 4.2 K refrigeration margin in a smaller package for greater installation flexibility in the APS storage ring. This paper presents ANSYS-based thermal analysis of the cryostat, including estimated static and dynamic (beam-induced) heating, and compares the new design with the existing planar SCU cryostat.
       </abstract>
    </record>
  </records>
</xml>
