| Title |
Study on Cooling Technology of the Superconducting Undulator at SSRF |
| Authors |
- Y. Liu, S. Sun, J. Wang, L. Wang, S.H. Wang
SINAP, Shanghai, People's Republic of China
|
| Abstract |
A superconducting undulator (SCU) prototpye with the period of 16 mm and the magnetic gap of 9.5 mm has been designed and fabricated at the Shanghai Institute of Applied Physics(SINAP) since late 2013. A set of cooling system is designed to cool down cold masses. This paper presents the details of their design, calculation and test: 4 small cryogenic refrigerators are used as cold sources, and the superconducting coil and beam pipe are independently cooled down; The 4.2 K superconducting coil is mainly cooled by the liquid helium tube of the thermosyphon loop with evaporation and recondensation; The 10~20 K ultra-high vacuum beam tube is cooled by heat conduction. The main sources and mechanism of thermal loads for SCU were analyzed. And experimental test of cooling technology for SCU prototype had been performed, the feasibility of cooling scheme and the rationality of the cooling structure for the SINAP SCU prototype were verified. The cryogenic test and operation of the SCU doesn't require the input of liquid helium from the outside, and is not limited by the liquid helium source. This is the characteristic of SINAP's SCU cooling technology.
|
| Paper |
download TUPH22.PDF [0.928 MB / 3 pages] |
| Export |
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| Conference |
MEDSI2018, Paris, France |
| Series |
Mechanical Engineering Design of Synchrotron Radiation Equipment and Instrumentation (10th) |
| Proceedings |
Link to full MEDSI2018 Proccedings |
| Session |
Accelerators and Core Technology |
| Date |
26-Jun-18 16:40–18:00 |
| Main Classification |
Accelerators |
| Sub Classification |
Insertion Devices |
| Keywords |
cryogenics, SRF, operation, radiation, undulator |
| Publisher |
JACoW Publishing, Geneva, Switzerland |
| Editors |
Volker RW Schaa (GSI, Darmstadt, Germany); Keihan Tavakoli (SOLEIL, Gif-sur-Yvette, France); Manuel Tilmont (SOLEIL, Gif-sur-Yvette, France) |
| ISBN |
978-3-95450-207-3 |
| Published |
December 2018 |
| Copyright |
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