Journals of Accelerator Conferences Website (JACoW)
JACoW
is a publisher in Geneva, Switzerland that publishes the
proceedings of accelator conferences held around the world
by an international collaboration of editors.
| URL | https://doi.org/10.18429/JACoW-LINAC2024-THPB027 |
|---|---|
| Title | Study of mechanical grinding effects on niobium surface |
| Authors |
|
| Abstract | Mechanical grinding is commonly employed to eliminate surface defects such as scratches and pits from niobium cavity surfaces or sheets before cavity fabrication. Subsequently, chemically buffered polishing or electropolishing is often utilized to completely remove residues of the polishing media and any defects induced by mechanical grinding, ensuring a pristine surface. In this study, we conducted a systematic investigation to assess the influence of mechanical grinding using silicon car-bide and aluminum oxide polishing media on niobium surfaces. Additionally, the study examines the effects of post-mechanical grinding chemical treatments on surface quality. |
| Paper | download: THPB027.pdf |
| Cite | BibTeX, LaTeX, Text/Word, RIS, EndNote |
| Conference | 32nd Linear Accelerator Conference (LINAC2024) |
| Series | |
| Location | Chicago, IL, USA |
| Date | 25-30 Aug 2024 |
| Publisher | JACoW Publishing, Geneva, Switzerland |
| Editorial Board | Kelly Jaje (ANL), Kip Bishofberger (LANL), Ryan Brody (ANL), Gustavo Bruno (ANL), Jan Chrin (PSI), Cathy Eyberger (ANL), Maggie Montes (SLAC), Denise Skiadopoulos (ANL), Ling Wang (MSU/FRIB), Kent Wootton (ANL) |
| Online ISBN | 978-3-95450-219-6 |
| Online ISSN | 2226-0366 |
| Received | 20 August 2024 |
| Revised | 06 September 2024 |
| Accepted | 06 September 2024 |
| Issued | 23 October 2024 |
| DOI | 10.18429/JACoW-LINAC2024-THPB027 |
| Pages | 689-691 |
| Copyright | Published by JACoW Publishing under the terms of the Creative Commons Attribution 4.0 license. Any further distribution of this work must maintain attribution to the author(s), the published article's title, publisher, and DOI. |