| Title |
Beam Dynamics for the FAIR p-Linac Ladder RFQ |
| Authors |
- M. Syha, U. Ratzinger, M. Schuett
IAP, Frankfurt am Main, Germany
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| Abstract |
After the successful measurements with a 0.8 m prototype a 3.3 m Ladder-RFQ is under construction at IAP, Goethe University Frankfurt. It is designed to accelerate protons from 95 keV to 3.0 MeV according to the design parameters of the p-Linac at FAIR. Along the acceleration section modulation parameter, aperture and synchronous phase all course (quasi-)linear, which differentiates this design approach from other designs developed at IAP. The ratio of transversal vane curvature radius to mid-cell radial aperture as well as the vane radius itself are constant, which favors a flat voltage distribution along the RFQ. This was verified by implantation of the modulated vane geometry into MWS-CST RF field simulations. The development of adequate beam dynamics was done in close collaboration with the IAP resonator design team. The Los Alamos RFQGen-code was used for the RFQ design and the beam dynamics simulations.
|
| Paper |
download TUPO083.PDF [0.403 MB / 3 pages] |
| Poster |
download TUPO083_POSTER.PDF [0.932 MB] |
| Export |
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| Conference |
LINAC2018 |
| Series |
Linear Accelerator Conference (29th) |
| Location |
Beijing, China |
| Date |
16-21 September 2018 |
| Publisher |
JACoW Publishing, Geneva, Switzerland |
| Editorial Board |
Guoxi Pei (IHEP, Beijing, China); Volker RW Schaa (GSI, Darmstadt, Germany); Yong Ho Chin (KEK, Tsukuba, Japan); Shinian Fu (IHEP, Beijing, China); Ning Zhao (IHEP, Beijing, China) |
| Online ISBN |
978-3-95450-194-6 |
| Online ISSN |
2226-0366 |
| Received |
12 September 2018 |
| Accepted |
08 October 2018 |
| Issue Date |
18 January 2019 |
| DOI |
doi:10.18429/JACoW-LINAC2018-TUPO083 |
| Copyright |
 Published by JACoW Publishing under the terms of the Creative Commons Attribution 3.0 International license. Any further distribution of this work must maintain attribution to the author(s), the published article's title, publisher, and DOI. |
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