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| URL | https://doi.org/10.18429/JACoW-IPAC2025-WEPS148 |
|---|---|
| Title | INFN LASA in-kind contribution to PIP-II |
| Authors |
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| Abstract | This paper reports the status and recent progress of INFN LASA’s in-kind contribution to the PIP-II project at Fermilab, with updates on key activities and major procurements. Production efforts for the 38 INFN LASA-designed, 5-cell cavities (β=0.61) for the LB650 section of the linac are underway and two pre-series prototypes are being realized as a first step to validate the manufacturing and treatment sequence. Concurrently, preliminary testing on existing prototypes is progressing to gain a deeper understanding of the surface preparation and qualification procedures, including cross-validation at different infrastructures. Series LB650 cavities will be industrially produced and surface-treated to achieve the stringent performance targets, qualified via vertical cold tests at DESY AMTF, and delivered installation-ready for string assembly. |
| Paper | download: WEPS148.pdf |
| Cite | BibTeX, LaTeX, Text/Word, RIS, EndNote |
| Conference | 16th International Particle Accelerator Conference |
| Series | |
| Location | Taipei, Taiwan |
| Date | 01-06 Jun 2025 |
| Publisher | JACoW Publishing, Geneva, Switzerland |
| Editorial Board | * Ming-Chyuan Lin - National Synchrotron Radiation Research Center * Yoichi Sato - KEK * Jui-Che Huang - National Synchrotron Radiation Research Center * David Button - Australian Nuclear Science and Technology Organisation * Ping-Shun Chuang - National Synchrotron Radiation Research Center |
| Online ISBN | 978-3-95450-248-6 |
| Online ISSN | 2673-5490 |
| Received | 28 May 2025 |
| Revised | 13 October 2025 |
| Accepted | 13 October 2025 |
| Issued | 05 November 2025 |
| DOI | 10.18429/JACoW-IPAC2025-WEPS148 |
| Pages | 2466-2468 |
| Copyright | Published by JACoW Publishing under the terms of the Creative Commons Attribution 4.0 license. Any further distribution of this work must maintain attribution to the author(s), the published article's title, publisher, and DOI. |