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URLhttps://doi.org/10.18429/JACoW-IPAC2025-THPB031
TitleExperimental studies of thermal contact conductance between copper, stainless steel and aluminum samples using a setup developed at ALBA Synchrotron Light Source
Authors
  • M. Quispe, C. Colldelram, J. Casas, B. de Abreu Francisco
    ALBA Synchrotron (Spain)
  • D. Ruiz Polishchuk
    La Romanica
  • O. Traver Ramos, M. Sanchez
    ALBA Synchrotron Light Source
AbstractAccurate knowledge of the Thermal Contact Conductance (TCC) between surfaces is of great importance for the design of components in particle accelerators, such as mirrors, monochromators, filters, detectors, among others. The TCC depends on many variables such as surface finish, type of material, pressure between samples, temperature and interface materials. The TCC can be found in specialized literature, but it is not always possible to find this information for all applications. This forces the design engineer to assume conservative or optimistic values that can result in over or under sized designs. In this context, an experimental setup has been developed in the Engineering Division of ALBA to evaluate thermal contacts under ambient and cryogenics conditions, in vacuum and for different pressure ranges between samples. This work presents the latest experimental results obtained for sample combinations of Copper, Stainless Steel and Aluminium materials.
Paperdownload: THPB031.pdf
CiteBibTeX, LaTeX, Text/Word, RIS, EndNote
Conference16th International Particle Accelerator Conference
Series
LocationTaipei, Taiwan
Date01-06 Jun 2025
PublisherJACoW Publishing, Geneva, Switzerland
Editorial Board* Ming-Chyuan Lin - National Synchrotron Radiation Research Center * Yoichi Sato - KEK * Jui-Che Huang - National Synchrotron Radiation Research Center * David Button - Australian Nuclear Science and Technology Organisation * Ping-Shun Chuang - National Synchrotron Radiation Research Center
Online ISBN978-3-95450-248-6
Online ISSN2673-5490
Received23 May 2025
Revised14 October 2025
Accepted14 October 2025
Issued05 November 2025
DOI10.18429/JACoW-IPAC2025-THPB031
Pages2580-2582