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| URL | https://doi.org/10.18429/JACoW-IPAC2025-MOPS055 |
|---|---|
| Title | Magnet assembly of IVUE32 in-vacuum-APPLE II at BESSY II |
| Authors |
|
| Abstract | At HZB / BESSY II the first in-vacuum APPLE II undu-lator is under construction. The design includes three magnet arrays for each of the four magnet rows for an efficient force compensation. The support and drive sys-tem has been delivered. Currently the magnets for the 10-period prototype are fabricated by Vacuumschmelze. Within the project IVUE32 a new soldering technique based on reactive foils has been developed in collabora-tion with Vacuumschmelze. The magnet structure of the IVUE32 undulator will employ the soldering technique aiming for enhanced assembly simplicity. Two new ex-perimental setups for the characterization of soldered subassemblies have been built for obtaining stress-strain curves and for lifetime (fatigue) tests. These instruments will be presented and measurements will be discussed. |
| Paper | download: MOPS055.pdf |
| Cite | BibTeX, LaTeX, Text/Word, RIS, EndNote |
| Conference | 16th International Particle Accelerator Conference |
| Series | |
| Location | Taipei, Taiwan |
| Date | 01-06 Jun 2025 |
| Publisher | JACoW Publishing, Geneva, Switzerland |
| Editorial Board | * Ming-Chyuan Lin - National Synchrotron Radiation Research Center * Yoichi Sato - KEK * Jui-Che Huang - National Synchrotron Radiation Research Center * David Button - Australian Nuclear Science and Technology Organisation * Ping-Shun Chuang - National Synchrotron Radiation Research Center |
| Online ISBN | 978-3-95450-248-6 |
| Online ISSN | 2673-5490 |
| Received | 19 May 2025 |
| Revised | 04 June 2025 |
| Accepted | 05 June 2025 |
| Issued | 05 November 2025 |
| DOI | 10.18429/JACoW-IPAC2025-MOPS055 |
| Pages | 741-744 |
| Copyright | Published by JACoW Publishing under the terms of the Creative Commons Attribution 4.0 license. Any further distribution of this work must maintain attribution to the author(s), the published article's title, publisher, and DOI. |