| Title |
ESS RFQ Electromagnetic Simulations Using CST Studio Suite |
| Authors |
- E. Trachanas, A. Bignami, N. Gazis, B. Jones, R. Zeng
ESS, Lund, Sweden
- G. Fikioris, E.N. Gazis, A. Kladas
National Technical University of Athens, Zografou, Greece
- P. Hamel, O. Piquet
CEA-IRFU, Gif-sur-Yvette, France
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| Abstract |
The Radio Frequency Quadrupole (RFQ) of the European Spallation Source (ESS), operates at 352.21 MHz with an RF pulse length of 3.2 ms and repetition rate of 14 Hz. The RFQ focuses, bunches and accelerates the 62.5 mA proton beam from 75 keV up to 3.6 MeV. In an effort to study and compare the results from 3D electromagnetic codes, different models of the RFQ were simulated with CST Studio suite. This paper presents the selection of optimal parameters for simulation of the RFQ cavity voltage and comparison of the results with the RFQ design code Toutatis.
|
| Paper |
download WEPOMS049.PDF [7.842 MB / 4 pages] |
| Cite |
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※ EndNote |
| Conference |
IPAC2022 |
| Series |
International Particle Accelerator Conference (13th) |
| Location |
Bangkok, Thailand |
| Date |
12-17 June 2022 |
| Publisher |
JACoW Publishing, Geneva, Switzerland |
| Editorial Board |
Frank Zimmermann (CERN, Meyrin, Switzerland); Hitoshi Tanaka (RIKEN, Hyogo, Japan); Porntip Sudmuang (SRLI, Nakhon, Thailand); Prapong Klysubun (SRLI, Nakhon, Thailand); Prapaiwan Sunwong (SRLI, Nakhon, Thailand); Thakonwat Chanwattana (SRLI, Nakhon, Thailand); Christine Petit-Jean-Genaz (CERN, Meyrin, Switzerland); Volker R.W. Schaa (GSI, Darmstadt, Germany) |
| Online ISBN |
978-3-95450-227-1 |
| Online ISSN |
2673-5490 |
| Received |
08 June 2022 |
| Revised |
09 June 2022 |
| Accepted |
15 June 2022 |
| Issue Date |
17 June 2022 |
| DOI |
doi:10.18429/JACoW-IPAC2022-WEPOMS049 |
| Pages |
2365-2368 |
| Copyright |
 Published by JACoW Publishing under the terms of the Creative Commons Attribution 3.0 International license. Any further distribution of this work must maintain attribution to the author(s), the published article's title, publisher, and DOI. |
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