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https://doi.org/10.18429/JACoW-IPAC2021-WEPAB334
Title Development of Diffusion Bonded Joints of AA6061 Aluminum Alloy to AISI 316LN Stainless Steel for Sirius Planar Undulators
Authors
  • R.L. Parise, O.R. Bagnato, R. Defavari, M.W.A. Feitosa, F.R. Francisco, D.Y. Kakizaki, R.D. Ribeiro
    LNLS, Campinas, Brazil
Abstract LNLS has been commissioning Sirius, a 4th-generation synchrotron light source. The commissioning of the beamlines has been mainly done by using planar undulator, which uses in-house built aluminum vacuum chambers with ultra-high vacuum tight bimetallic flanges. In order to manufacture these flanges, diffusion bonded joints of AA6061 aluminum alloy to AISI 316LN stainless steel were developed. Diffusion bonding was carried out at 400-500°C for 45-60 min, applying a load of 9.8MPa in a vacuum furnace. Also, the surface preparation for Al and SS was investigated. SEM observation revealed that an 1-3 µm reaction layer was formed at the AA6061/Ni-plated interface. The intermetallic compound Al3Ni was identified in the reaction layer. The obtained Al/SS joints showed mean ultimate strength of 84 MPa, with the fracture occurring in the Al/reaction layer interface. Bake-out cycles followed by leak tests were carried out to validate the process and approve their use on the planar undulator vacuum chambers. Two undulators with Al/SS flanges have been installed and are under operation in the storage ring.
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Conference IPAC2021
Series International Particle Accelerator Conference (12th)
Location Campinas, SP, Brazil
Date 24-28 May 2021
Publisher JACoW Publishing, Geneva, Switzerland
Editorial Board Liu Lin (LNLS, Campinas, Brazil); John M. Byrd (ANL, Lemont, IL, USA); Regis Neuenschwander (LNLS, Campinas, Brazil); Renan Picoreti (LNLS, Campinas, Brazil); Volker R. W. Schaa (GSI, Darmstadt, Germany)
Online ISBN 978-3-95450-214-1
Online ISSN 2673-5490
Received 17 May 2021
Accepted 17 June 2021
Issue Date 31 August 2021
DOI doi:10.18429/JACoW-IPAC2021-WEPAB334
Pages 3459-3462
Copyright
Creative Commons CC logoPublished by JACoW Publishing under the terms of the Creative Commons Attribution 3.0 International license. Any further distribution of this work must maintain attribution to the author(s), the published article's title, publisher, and DOI.