| Title |
Transverse Density Pileup and Pattern Formation in Dense Ultracold Electron Beamlets under Coulomb Expansion |
| Authors |
- A.J. Tencate, K. Bhuyan, B. Erdélyi
Northern Illinois University, DeKalb, Illinois, USA
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| Abstract |
Dynamic Coulomb expansion of dense particle bunches can lead to transverse density shock-like propagation for nonuniform bunch distributions. Furthermore, under favorable circumstances, multiple bunches in close proximity can collide without crossing to form wheel-and-spoke patterns. This process has been observed experimentally for Rubidium ions, but not yet for electrons, where the dynamics occur over far shorter length scales. We simulate the interaction of electron bunches while varying the initial transverse temperature and density profiles to determine the thresholds that characterize this pattern formation. Additionally, we consider the effects of asymmetries and the impact of a low-density halo on the overall process. The simulations are conducted using a novel high-fidelity algorithm for collisional particle dynamics.
|
| Funding |
This work was sponsored by the US Department of Energy Office of Science under Grant DE-SC0020241. |
| Paper |
download WEPAB229.PDF [2.503 MB / 4 pages] |
| Poster |
download WEPAB229_POSTER.PDF [7.411 MB] |
| Export |
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| Conference |
IPAC2021 |
| Series |
International Particle Accelerator Conference (12th) |
| Location |
Campinas, SP, Brazil |
| Date |
24-28 May 2021 |
| Publisher |
JACoW Publishing, Geneva, Switzerland |
| Editorial Board |
Liu Lin (LNLS, Campinas, Brazil); John M. Byrd (ANL, Lemont, IL, USA); Regis Neuenschwander (LNLS, Campinas, Brazil); Renan Picoreti (LNLS, Campinas, Brazil); Volker R. W. Schaa (GSI, Darmstadt, Germany) |
| Online ISBN |
978-3-95450-214-1 |
| Online ISSN |
2673-5490 |
| Received |
19 May 2021 |
| Accepted |
02 July 2021 |
| Issue Date |
13 August 2021 |
| DOI |
doi:10.18429/JACoW-IPAC2021-WEPAB229 |
| Pages |
3169-3172 |
| Copyright |
 Published by JACoW Publishing under the terms of the Creative Commons Attribution 3.0 International license. Any further distribution of this work must maintain attribution to the author(s), the published article's title, publisher, and DOI. |
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