| Title |
Progress of the Development of a Superconducting Undulator as a THz Source for FELs |
| Authors |
- J. Gethmann, S. Casalbuoni, N. Glamann, A.W. Grau, A.-S. Müller, D. Saez de Jauregui
KIT, Karlsruhe, Germany
- D. Astapovych, H. De Gersem, E. Gjonaj
TEMF, TU Darmstadt, Darmstadt, Germany
- S. Casalbuoni
EuXFEL, Schenefeld, Germany
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| Abstract |
To produce radiation in the THz frequency range at X-ray Free Electron Lasers, undulators with large period length, high fields, and large gaps are required. These demands can be fulfilled by superconducting undulators. In this contribution, the actual requirements on the main parameters of such a superconducting undulator will be discussed and the progress of the design will be discussed. In addition, beam impedance and heat load results obtained analytically as well as by large-scale wakefield simulations will be presented.
|
| Funding |
This work is supported by the BMBF project 05K19VK2 SCUXFEL (Federal Ministry of Education and Research) and by the DFG-funded Doctoral School KSETA: Science and Technology. |
| Paper |
download WEPAB135.PDF [0.230 MB / 3 pages] |
| Export |
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| Conference |
IPAC2021 |
| Series |
International Particle Accelerator Conference (12th) |
| Location |
Campinas, SP, Brazil |
| Date |
24-28 May 2021 |
| Publisher |
JACoW Publishing, Geneva, Switzerland |
| Editorial Board |
Liu Lin (LNLS, Campinas, Brazil); John M. Byrd (ANL, Lemont, IL, USA); Regis Neuenschwander (LNLS, Campinas, Brazil); Renan Picoreti (LNLS, Campinas, Brazil); Volker R. W. Schaa (GSI, Darmstadt, Germany) |
| Online ISBN |
978-3-95450-214-1 |
| Online ISSN |
2673-5490 |
| Received |
19 May 2021 |
| Accepted |
02 July 2021 |
| Issue Date |
31 August 2021 |
| DOI |
doi:10.18429/JACoW-IPAC2021-WEPAB135 |
| Pages |
2933-2935 |
| Copyright |
 Published by JACoW Publishing under the terms of the Creative Commons Attribution 3.0 International license. Any further distribution of this work must maintain attribution to the author(s), the published article's title, publisher, and DOI. |
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