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https://doi.org/10.18429/JACoW-IPAC2021-TUPAB340
Title Design of the Magnetic Shielding for 166 MHz and 500 MHz Superconducting RF Cavities at High Energy Photon Source
Authors
  • L. Guo, Y. Chen, J. Li, Z.Q. Li, Q. Ma, P. Zhang, X.Y. Zhang, H.J. Zheng
    IHEP, Beijing, People’s Republic of China
Abstract Five 166 MHz quarter-wave β=1 superconducting cavities and two 500 MHz single-cell elliptical superconducting cavities have been designed for the storage ring of High Energy Photon Source (HEPS). It is necessary to shield magnetic field for superconducting cavities to reduce the residual surface resistance due to magnetic flux trapping during cavity cool down. The magnetic shielding for both 166 MHz and 500 MHz superconducting cavities have been designed. The residual magnetic field inside the cavities have been calculated by using Opera-3D simulation software. The geographic location of the cavity being installed at the HEPS site and the fringe field of the upstream magnet are considered. These are reported in this paper.
Funding This work was supported by High Energy Photon Source, a major national science and technology infrastructure in China.
Paper download TUPAB340.PDF [1.710 MB / 3 pages]
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Conference IPAC2021
Series International Particle Accelerator Conference (12th)
Location Campinas, SP, Brazil
Date 24-28 May 2021
Publisher JACoW Publishing, Geneva, Switzerland
Editorial Board Liu Lin (LNLS, Campinas, Brazil); John M. Byrd (ANL, Lemont, IL, USA); Regis Neuenschwander (LNLS, Campinas, Brazil); Renan Picoreti (LNLS, Campinas, Brazil); Volker R. W. Schaa (GSI, Darmstadt, Germany)
Online ISBN 978-3-95450-214-1
Online ISSN 2673-5490
Received 18 May 2021
Accepted 17 June 2021
Issue Date 10 August 2021
DOI doi:10.18429/JACoW-IPAC2021-TUPAB340
Pages 2289-2291
Copyright
Creative Commons CC logoPublished by JACoW Publishing under the terms of the Creative Commons Attribution 3.0 International license. Any further distribution of this work must maintain attribution to the author(s), the published article's title, publisher, and DOI.