| Title |
Surface Roughness Reduction of Nb₃Sn Thin Films via Laser Annealing for Superconducting Radio-Frequency Cavities |
| Authors |
- Z. Sun, M. Ge, M. Liepe, T.E. Oseroff, R.D. Porter
Cornell University (CLASSE), Cornell Laboratory for Accelerator-Based Sciences and Education, Ithaca, New York, USA
- A.B. Connolly, M.O. Thompson
Cornell University, Ithaca, USA
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| Abstract |
Superconducting radio frequency (SRF) cavities, a key component of particle accelerators, await new SRF materials beyond the state-of-the-art niobium. Nb₃Sn is one of the most competitive candidates, since it increases the superheating field, allows the operation temperature up to 4K, and improves cavity efficiency. Surface roughness and grain boundaries, however, significantly affect the RF performance of current Nb₃Sn cavities. Here, we explore a post laser annealing technique to reduce the surface roughness. In doing so, we deposited a TiN laser-absorber on Nb₃Sn and Nb surfaces, and then annealed the samples by laser scanning via different laser systems. The Nb₃Sn surface roughness was minimized to 101 nm (Ra) by laser annealing via 308 nm, 35 ns pulses. Surface imaging and Fourier analysis revealed laser annealing is able to remove sharp edges and <1 um wavelength features.
|
| Paper |
download TUPAB338.PDF [0.908 MB / 3 pages] |
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| Conference |
IPAC2021 |
| Series |
International Particle Accelerator Conference (12th) |
| Location |
Campinas, SP, Brazil |
| Date |
24-28 May 2021 |
| Publisher |
JACoW Publishing, Geneva, Switzerland |
| Editorial Board |
Liu Lin (LNLS, Campinas, Brazil); John M. Byrd (ANL, Lemont, IL, USA); Regis Neuenschwander (LNLS, Campinas, Brazil); Renan Picoreti (LNLS, Campinas, Brazil); Volker R. W. Schaa (GSI, Darmstadt, Germany) |
| Online ISBN |
978-3-95450-214-1 |
| Online ISSN |
2673-5490 |
| Received |
20 May 2021 |
| Accepted |
09 June 2021 |
| Issue Date |
19 August 2021 |
| DOI |
doi:10.18429/JACoW-IPAC2021-TUPAB338 |
| Pages |
2283-2285 |
| Copyright |
 Published by JACoW Publishing under the terms of the Creative Commons Attribution 3.0 International license. Any further distribution of this work must maintain attribution to the author(s), the published article's title, publisher, and DOI. |
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