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https://doi.org/10.18429/JACoW-IPAC2021-TUPAB167
Title Status of Conduction Cooled SRF Photogun for UEM/UED
Authors
  • R.A. Kostin, C. Jing
    Euclid Beamlabs, Bolingbrook, USA
  • P.V. Avrakhov, A. Liu, Y. Zhao
    Euclid TechLabs, Solon, Ohio, USA
Abstract Benefiting from the rapid progress on RF photogun technologies in the past two decades, the development of MeV range ultrafast electron diffraction/microscopy (UED and UEM) has been identified as an enabling instrumentation. UEM or UED use low power electron beams with modest energies of a few MeV to study ultrafast phenomena in a variety of novel and exotic materials. SRF photoguns become a promising candidate to produce highly stable electrons for UEM/UED applications because of the ultrahigh shot-to-shot stability compared to room temperature RF photoguns. SRF technology was prohibitively expensive for industrial use until two recent advancements: Nb₃Sn and conduction cooling. The use of Nb₃Sn allows to operate SRF cavities at higher temperatures (4K) with low power dissipation which is within the reach of commercially available closed-cycle cryocoolers. Euclid is developing a continuous wave (CW), 1.5-cell, MeV-scale SRF conduction cooled photogun operating at 1.3 GHz. In this paper, the technical details of the design and first experimental data are presented.
Funding DOE #DE-SC0018621
Paper download TUPAB167.PDF [1.905 MB / 4 pages]
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Conference IPAC2021
Series International Particle Accelerator Conference (12th)
Location Campinas, SP, Brazil
Date 24-28 May 2021
Publisher JACoW Publishing, Geneva, Switzerland
Editorial Board Liu Lin (LNLS, Campinas, Brazil); John M. Byrd (ANL, Lemont, IL, USA); Regis Neuenschwander (LNLS, Campinas, Brazil); Renan Picoreti (LNLS, Campinas, Brazil); Volker R. W. Schaa (GSI, Darmstadt, Germany)
Online ISBN 978-3-95450-214-1
Online ISSN 2673-5490
Received 29 May 2021
Accepted 21 June 2021
Issue Date 01 September 2021
DOI doi:10.18429/JACoW-IPAC2021-TUPAB167
Pages 1773-1776
Copyright
Creative Commons CC logoPublished by JACoW Publishing under the terms of the Creative Commons Attribution 3.0 International license. Any further distribution of this work must maintain attribution to the author(s), the published article's title, publisher, and DOI.