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https://doi.org/10.18429/JACoW-IPAC2021-THPAB043
Title A Superconducting Undulator for CompactLight: Resistive Wall Wakefield Analysis
Authors
  • K.B. Marinov
    STFC/DL/ASTeC, Daresbury, Warrington, Cheshire, United Kingdom
Abstract The CompactLight project is an advanced X-ray FEL light source, with high-frequency, high-gradient linacs and compact undulators. Lower electron energies give higher energy efficiency and a smaller environmental footprint. The extremely short bunch lengths (few fs) and narrow undulator gaps (4 mm) drastically increase the impact of resistive wall wakefields on the lasing process. The longitudinal resistive wall wakefield impedance is calculated in the framework of the surface impedance approach, in accordance with anomalous skin effect (ASE) theory. The dependence of the electron energy loss factor and the correlated energy spread of the bunch on the residual resistivity ratio (RRR) for both copper and aluminum is much higher for long (100 fs) than for ultra-short (6 fs) bunches. This is due to a known property of the longitudinal wakefield impedance - the field acting on a single particle traversing a resistive vessel does not depend on the conductivity of the vessel. The wakefields generated by the ultra-short bunch are already close to that of a single-particle regime and this leads to interesting consequences which are discussed in the present work.
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Conference IPAC2021
Series International Particle Accelerator Conference (12th)
Location Campinas, SP, Brazil
Date 24-28 May 2021
Publisher JACoW Publishing, Geneva, Switzerland
Editorial Board Liu Lin (LNLS, Campinas, Brazil); John M. Byrd (ANL, Lemont, IL, USA); Regis Neuenschwander (LNLS, Campinas, Brazil); Renan Picoreti (LNLS, Campinas, Brazil); Volker R. W. Schaa (GSI, Darmstadt, Germany)
Online ISBN 978-3-95450-214-1
Online ISSN 2673-5490
Received 19 May 2021
Accepted 21 June 2021
Issue Date 21 August 2021
DOI doi:10.18429/JACoW-IPAC2021-THPAB043
Pages 3841-3843
Copyright
Creative Commons CC logoPublished by JACoW Publishing under the terms of the Creative Commons Attribution 3.0 International license. Any further distribution of this work must maintain attribution to the author(s), the published article's title, publisher, and DOI.