| Title |
Shielded Pair Method for Cylindrical Surface Resistance Measurement at Cryogenic Temperature |
| Authors |
- K. Brunner, S. Calatroni, F. Caspers
CERN, Geneva, Switzerland
- D. Barna
Wigner Research Centre for Physics, Institute for Particle and Nuclear Physics, Budapest, Hungary
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| Abstract |
The shielded pair resonator method was already used in the past at CERN to measure the surface resistivity of the LHC beam screen both at room temperature and cryogenic temperature. We have refined and adapted the measurement to be able to measure other types of beam screens and also to operate in a strong dipolar magnetic field. This is necessary for testing the properties of HTS coated beam screens or the possible effects of coatings and surface treatments for e-cloud suppression. Several calibration runs were done at cryogenic temperatures (4.2 K) measuring the surface resistivity of a copper pipe to identify the precision, stability and reproducibility achievable using this method. This work describes the challenges of the measurement and ways to mitigate them.
|
| Paper |
download MOPAB364.PDF [0.289 MB / 4 pages] |
| Export |
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| Conference |
IPAC2021 |
| Series |
International Particle Accelerator Conference (12th) |
| Location |
Campinas, SP, Brazil |
| Date |
24-28 May 2021 |
| Publisher |
JACoW Publishing, Geneva, Switzerland |
| Editorial Board |
Liu Lin (LNLS, Campinas, Brazil); John M. Byrd (ANL, Lemont, IL, USA); Regis Neuenschwander (LNLS, Campinas, Brazil); Renan Picoreti (LNLS, Campinas, Brazil); Volker R. W. Schaa (GSI, Darmstadt, Germany) |
| Online ISBN |
978-3-95450-214-1 |
| Online ISSN |
2673-5490 |
| Received |
17 May 2021 |
| Accepted |
22 June 2021 |
| Issue Date |
12 August 2021 |
| DOI |
doi:10.18429/JACoW-IPAC2021-MOPAB364 |
| Pages |
1132-1135 |
| Copyright |
 Published by JACoW Publishing under the terms of the Creative Commons Attribution 3.0 International license. Any further distribution of this work must maintain attribution to the author(s), the published article's title, publisher, and DOI. |
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