| Title |
Cryogenic, in-Vacuum Magnetic Measurement Setup for Superconducting Undulators |
| Authors |
- A.W. Grau, S. Casalbuoni, N. Glamann, D. Saez de Jauregui
KIT, Eggenstein-Leopoldshafen, Germany
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| Abstract |
The magnetic field quality has a strong impact on the performance of insertion devices (IDs) when installed in synchrotron light sources. Superconducting IDs have the advantage to produce a higher magnetic peak field for a given gap and period length than IDs assembled with permanent magnets. Before installation of a superconducting ID in a synchrotron light source it is of fundamental importance to characterize the magnetic properties by accurate field and field integral measurements. We follow this aim within our R&D program for superconducting undulators (SCUs). In this contribution, we describe the equipment and the challenges of a cryogenic, in vacuum measurement setup to perform magnetic measurements of the local field, the field integrals and the multipole components of in vacuum SCUs assembled in the final cryostat.
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| Paper |
download TUPRB015.PDF [1.530 MB / 4 pages] |
| Export |
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| Conference |
IPAC2019 |
| Series |
International Particle Accelerator Conference (10th) |
| Location |
Melbourne, Australia |
| Date |
19-24 May 2019 |
| Publisher |
JACoW Publishing, Geneva, Switzerland |
| Editorial Board |
Mark Boland (UoM, Saskatoon, SK, Canada); Hitoshi Tanaka (KEK, Tsukuba, Japan); David Button (ANSTO, Kirrawee, NSW, Australia); Rohan Dowd (ANSTO, Kirrawee, NSW, Australia); Volker RW Schaa (GSI, Darmstadt, Germany); Eugene Tan (ANSTO, Kirrawee, NSW, Australia) |
| Online ISBN |
978-3-95450-208-0 |
| Received |
29 April 2019 |
| Accepted |
23 May 2019 |
| Issue Date |
21 June 2019 |
| DOI |
doi:10.18429/JACoW-IPAC2019-TUPRB015 |
| Pages |
1709-1712 |
| Copyright |
 Published by JACoW Publishing under the terms of the Creative Commons Attribution 3.0 International license. Any further distribution of this work must maintain attribution to the author(s), the published article's title, publisher, and DOI. |
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