| Title |
Conceptual Design of the Diamond-II Vacuum System |
| Authors |
- M.P. Cox, C. Burrows, A.G. Day, J.A. Dymoke-Bradshaw, R.K. Grant, N.P. Hammond, X. Liu, A.G. Miller, H.S. Shiers, N. Warner
DLS, Oxfordshire, United Kingdom
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| Abstract |
The conceptual design of the vacuum system for the Diamond-II storage ring upgrade is described. Due to the small vessel cross section, typically 20 mm inside diameter (ID), and the consequent conductance limitation, distributed pumping is provided by non-evaporable getter (NEG) coating supplemented by ion pumps at high gas load locations. In-situ bakeout is incorporated to allow rapid recovery from both planned vacuum interventions and unplanned vacuum events. The vacuum vessels are constructed mainly from copper alloy while stainless steel is used in regions of AC magnets requiring low electrical conductivity. The proposed layout, engineering and build sequence of the vacuum system are described along with gas flow simulations confirming the vacuum performance advantages of NEG-coated vessels compared with uncoated vessels.
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| Paper |
download TUPMP050.PDF [1.404 MB / 3 pages] |
| Export |
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| Conference |
IPAC2019 |
| Series |
International Particle Accelerator Conference (10th) |
| Location |
Melbourne, Australia |
| Date |
19-24 May 2019 |
| Publisher |
JACoW Publishing, Geneva, Switzerland |
| Editorial Board |
Mark Boland (UoM, Saskatoon, SK, Canada); Hitoshi Tanaka (KEK, Tsukuba, Japan); David Button (ANSTO, Kirrawee, NSW, Australia); Rohan Dowd (ANSTO, Kirrawee, NSW, Australia); Volker RW Schaa (GSI, Darmstadt, Germany); Eugene Tan (ANSTO, Kirrawee, NSW, Australia) |
| Online ISBN |
978-3-95450-208-0 |
| Received |
14 May 2019 |
| Accepted |
22 May 2019 |
| Issue Date |
21 June 2019 |
| DOI |
doi:10.18429/JACoW-IPAC2019-TUPMP050 |
| Pages |
1362-1364 |
| Copyright |
 Published by JACoW Publishing under the terms of the Creative Commons Attribution 3.0 International license. Any further distribution of this work must maintain attribution to the author(s), the published article's title, publisher, and DOI. |
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