| Title |
Challenges Towards Industrialization of the ERL-FEL Light Source for EUV Lithography |
| Authors |
- N. Nakamura, E. Kako, R. Kato, H. Kawata, T. Miyajima, H. Sakai, K. Umemori
KEK, Ibaraki, Japan
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| Abstract |
EUV Lithography is going to HVM (high volume manufacturing) stage with 250-W-class laser-produced plasma sources and it is important to develop a new-type EUV light source to meet future demand for higher power. Energy-recovery linac based free-electron lasers (ERL-FELs) are possible candidates of a high-power EUV light source that can distribute 1 kW power to multiple scanners simultaneously. In Japan, an ERL-FEL based EUV light source has been designed using available technologies without much development to demonstrate generation of EUV power more than 10 kW and the EUV-FEL Light Source Study Group for Industrialization has been established since 2015 to realize industrialization of the light source and the related items. For industrialization, high availability is essential as well as high power and reduction of the light source size is also required. In this paper, we will report an overview of the designed ERL-FEL light source for EUV lithography and some activities for the industrialization and describe considerations and developments for obtaining high availability and size reduction of the light source.
|
| Paper |
download THPMP013.PDF [1.263 MB / 4 pages] |
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| Conference |
IPAC2019 |
| Series |
International Particle Accelerator Conference (10th) |
| Location |
Melbourne, Australia |
| Date |
19-24 May 2019 |
| Publisher |
JACoW Publishing, Geneva, Switzerland |
| Editorial Board |
Mark Boland (UoM, Saskatoon, SK, Canada); Hitoshi Tanaka (KEK, Tsukuba, Japan); David Button (ANSTO, Kirrawee, NSW, Australia); Rohan Dowd (ANSTO, Kirrawee, NSW, Australia); Volker RW Schaa (GSI, Darmstadt, Germany); Eugene Tan (ANSTO, Kirrawee, NSW, Australia) |
| Online ISBN |
978-3-95450-208-0 |
| Received |
13 May 2019 |
| Accepted |
22 May 2019 |
| Issue Date |
21 June 2019 |
| DOI |
doi:10.18429/JACoW-IPAC2019-THPMP013 |
| Pages |
3478-3481 |
| Copyright |
 Published by JACoW Publishing under the terms of the Creative Commons Attribution 3.0 International license. Any further distribution of this work must maintain attribution to the author(s), the published article's title, publisher, and DOI. |
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