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https://doi.org/10.18429/JACoW-IBIC2023-WEP025
Title A Study of the Gain of Microchannel Plates in the Ionization Profile Monitors at Fermilab
Authors
  • R.M. Thurman-Keup, C.E. Lundberg, D. Slimmer, J.R. Zagel
    Fermilab, Batavia, Illinois, USA
Abstract One of the on-going issues with the use of microchannel plates (MCP) in the ionization profile monitors (IPM) at Fermilab is the significant decrease in gain over time. There are several possible issues that can cause this. Historically, the assumption has been that this is aging, where the secondary emission yield (SEY) of the pore surface changes after some amount of extracted charge. Recent literature searches have brought to light the possibility that this is an initial ’scrubbing’ effect whereby adsorbed gasses are removed from the MCP pores by the removal of charge from the MCP. This paper discusses the results of studies conducted on the IPMs in the Main Injector at Fermilab.
Funding This work was produced by Fermi Research Alliance, LLC under Contract No. DE-AC02-07CH11359 with the U.S. Department of Energy.
Paper download WEP025.PDF [1.178 MB / 5 pages]
Poster download WEP025_POSTER.PDF [7.408 MB]
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Conference IBIC2023
Series International Beam Instrumentation Conference (12th)
Location Saskatoon, Canada
Date 10-14 September 2023
Publisher JACoW Publishing, Geneva, Switzerland
Editorial Board Volker R.W. Schaa (GSI, Darmstadt, Germany); Tonia Batten (CLS, Saskatoon, Canada); Michael Bree (CLS, Saskatoon, Canada); Christine Petit-Jean-Genaz (CERN, Geneva, Switzerland); Darren Hunter (CLS, Saskatoon, Canada)
Online ISBN 978-3-95450-236-3
Online ISSN 2673-5350
Received 08 September 2023
Revised 10 September 2023
Accepted 11 September 2023
Issue Date 18 September 2023
DOI doi:10.18429/JACoW-IBIC2023-WEP025
Pages 405-409
Copyright
Creative Commons CC logoPublished by JACoW Publishing under the terms of the Creative Commons Attribution 4.0 International license. Any further distribution of this work must maintain attribution to the author(s), the published article's title, publisher, and DOI.