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'Journal of Accelerator Conferences Website' (JACoW) is a publisher in Geneva, Switzerland that publishes the proceedings of accelerator conferences held around the world by an international collaboration of editors.


https://doi.org/10.18429/JACoW-FLS2023-WE4P14
Title Layout of the Undulator-to-dump line at the SHINE
Authors
  • T. Liu, S. Chen, H.X. Deng, B. Liu, Z. Qi
    SARI-CAS, Pudong, Shanghai, People’s Republic of China
  • Z.F. Gao
    SSRF, Shanghai, People’s Republic of China
  • N. Huang
    Zhangjiang Lab, Shanghai, People’s Republic of China
Abstract The Shanghai HIgh repetitioN rate XFEL and Extreme light Facility as the first hard X-ray free-electron laser (FEL) facility in China, is currently under construction in the Zhangjiang area, Shanghai. It aims to deliver X-ray covering photon energy range from 0.4 to 25 keV, with electron beam power up to 800 kW. Downstream of the undulator line, the beam transport design of the undulator-to-dump line is critical which is mainly used for realization of FEL diagnostics based on transverse deflecting structure and beam absorption in the dump. In this manuscript we describe the current layout of this system.
Paper download WE4P14.PDF [0.959 MB / 4 pages]
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Conference FLS2023
Series ICFA Advanced Beam Dynamics Workshop (67th)
Location Luzern, Switzerland
Date 27 August-01 September 2023
Publisher JACoW Publishing, Geneva, Switzerland
Editorial Board Hans-Heinrich Braun (PSI, Villigen, Switzerland); Jan Chrin (PSI, Villigen, Switzerland); Romain Ganter (PSI, Villigen, Switzerland); Nicole Hiller (PSI, Villigen, Switzerland); Volker RW Schaa (GSI, Darmstadt, Germany)
Online ISBN 978-3-95450-224-0
Online ISSN 2673-7035
Received 20 August 2023
Revised 22 August 2023
Accepted 31 August 2023
Issued 02 December 2023
DOI doi:10.18429/JACoW-FLS2023-WE4P14
Pages 177-180
Copyright
Creative Commons CC logoPublished by JACoW Publishing under the terms of the Creative Commons Attribution 4.0 International license. Any further distribution of this work must maintain attribution to the author(s), the published article's title, publisher, and DOI.