| Title |
Super-X: Simulations for Extremely Hard X-Ray Generation With Short Period Superconducting Undulators for the European XFEL |
| Authors |
- S. Serkez, G. Geloni, S. Karabekyan, Y. Li, T. Tanikawa, S. Tomin, F. Wolff-Fabris
EuXFEL, Schenefeld, Germany
- C. Boffo
Bilfinger Noell GmbH, Wuerzburg, Germany
- S. Casalbuoni
KIT, Eggenstein-Leopoldshafen, Germany
- M. Dohlus, E. Schneidmiller, M.V. Yurkov, I. Zagorodnov
DESY, Hamburg, Germany
- A. Trebushinin
BINP, Novosibirsk, Russia
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| Abstract |
The European XFEL is a high-repetition multi-user facility with nominal photon energy range covering almost 3 orders of magnitude: 250 eV - 25 keV. In this work we explore the possibility to extend the photon energy range of the facility up to 100 keV via combination of superconducting undulator technology, period doubling and harmonic lasing, thus allowing for excellent tunability. To this purpose, we propose a dedicated FEL line, discuss its overall concept and provide analytical and numerical estimations of its expected performance.
|
| Paper |
download TUP061.PDF [0.771 MB / 4 pages] |
| Export |
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| Conference |
FEL2019 |
| Series |
Free Electron Laser Conference (39th) |
| Location |
Hamburg, Germany |
| Date |
26-30 August 2019 |
| Publisher |
JACoW Publishing, Geneva, Switzerland |
| Editorial Board |
Volker R.W. Schaa (GSI, Darmstadt, Germany); Winfried Decking (DESY, Hamburg, Germany); Harald Sinn (EuXFEL, Schenefeld, Germany); Gianluca Geloni (EuXFEL, Schenefeld, Germany); Siegfried Schreiber (DESY, Hamburg, Germany); Michaela Marx (DESY, Hamburg, Germany) |
| Online ISBN |
978-3-95450-210-3 |
| Online ISSN |
"" |
| Received |
20 August 2019 |
| Accepted |
25 August 2019 |
| Issue Date |
05 November 2019 |
| DOI |
doi:10.18429/JACoW-FEL2019-TUP061 |
| Pages |
191-194 |
| Copyright |
 Published by JACoW Publishing under the terms of the Creative Commons Attribution 3.0 International license. Any further distribution of this work must maintain attribution to the author(s), the published article's title, publisher, and DOI. |
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