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https://doi.org/10.18429/JACoW-eeFACT2018-TUYAA04
Title Study to Mitigate Electron Cloud Effect in SuperKEKB
Authors
  • Y. Suetsugu, H. Fukuma, K. Ohmi, K. Shibata, M. Tobiyama
    KEK, Ibaraki, Japan
Abstract During Phase-1 commissioning of the SuperKEKB from February to June 2016, electron cloud effects (ECE) were observed in the positron ring. The electron clouds were considered to exist in the beam pipes in the drift spaces of the ring, where the beam pipes have antechambers and titanium nitride (TiN) coating as countermeasures against ECE. Following this, permanent magnets and solenoids were attached to the beam pipes as additional countermeasures. Consequently, during Phase-2 commissioning from March to July 2018, experiments showed that the threshold beam current for exciting ECE increased by a factor of at least two relative to that during Phase-1 commissioning. While the countermeasures were strengthened, the effectiveness of the antechambers and TiN film coating was re-evaluated. From various simulations and experiments during Phase-2 commissioning, the antechamber was found to be less effective than expected with regard to reducing the number of photoelectrons in the beam channel. The TiN film coating, on the other hand, was considered to have a low secondary electron yield as expected.
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Conference eeFACT2018
Series ICFA ABDW on High Luminosity Circular e$^+$e$^-$ Colliders (62nd)
Location Hong Kong, China
Date 24-27 September 2018
Publisher JACoW Publishing, Geneva, Switzerland
Editorial Board Ying-ying Li (HKUST, Hong Kong, China); Lu Li (IMP/CAS, Lanzhou, China); Volker RW Schaa (GSI, Darmstadt, Germany)
Online ISBN 978-3-95450-216-5
Received 27 September 2018
Accepted 19 February 2019
Issue Date 21 April 2019
DOI doi:10.18429/JACoW-eeFACT2018-TUYAA04
Copyright
Creative Commons CC logoPublished by JACoW Publishing under the terms of the Creative Commons Attribution 3.0 International license. Any further distribution of this work must maintain attribution to the author(s), the published article's title, publisher, and DOI.