<xml>
  <records>
    <record>
       <contributors>
          <authors>
             <author>Palmieri, V.</author>
             <author>Vaglio, R.</author>
          </authors>
       </contributors>
       <titles>
          <title>
             Thermal Contact Resistance at the Nb-Cu Interface
          </title>
       </titles>
		 <publisher>JACoW</publisher>
       <pub-location>Geneva, Switzerland</pub-location>
		 <isbn>978-3-95450-178-6</isbn>
		 <electronic-resource-num>10.18429/JACoW-SRF2015-TUBA02</electronic-resource-num>
		 <language>English</language>
		 <pages>488-493</pages>
       <pages>TUBA02</pages>
       <keywords>
          <keyword>cavity</keyword>
          <keyword>interface</keyword>
          <keyword>niobium</keyword>
          <keyword>feedback</keyword>
          <keyword>superconductivity</keyword>
       </keywords>
       <work-type>Contribution to a conference proceedings</work-type>
       <dates>
          <year>2015</year>
          <pub-dates>
             <date>2015-12</date>
          </pub-dates>
       </dates>
       <urls>
          <related-urls>
              <url>http://dx.doi.org/10.18429/JACoW-SRF2015-TUBA02</url>
              <url>http://srf2015.vrws.de/papers/tuba02.pdf</url>
          </related-urls>
       </urls>
       <abstract>
          Niobium thin film sputtered copper cavities are strongly limited for the application in high field accelerators by the unsolved “Q-slope” problem. In the present paper, we examine the different contributions of the niobium film, the copper substrate, the Helium-Copper interface and the Niobium-Copper Interface, proposing the hypothesis that main cause of losses is due to an enhanced thermal boundary resistance RNb/Cu at the Nb/Cu interface, due to poor thermal contact between film and substrate. So, starting from different Q vs Eacc experimental curves from different sources, and using a typical “inverse problem” method, we deduced the corresponding distribution functions generating those curves. Assuming that only a small fraction of the film over the cavity surface is in poor thermal contact with the substrate (or even partially detached), due to bad adhesion problems, we propose as a possible solution of the problem, the possibility to use higher temperatures of deposition and the adoption at the interface of a buffer layer of a material that alloys both with Copper and with Niobium.
       </abstract>
    </record>
  </records>
</xml>
