<xml>
  <records>
    <record>
       <contributors>
          <authors>
             <author>Malloch, I.M.</author>
             <author>LaVere, M.J.</author>
             <author>Metzgar, E.S.</author>
             <author>Popielarski, L.</author>
          </authors>
       </contributors>
       <titles>
          <title>
             SRF Cavity Processing and Chemical Etching Development for the FRIB Linac
          </title>
       </titles>
		 <publisher>JACoW</publisher>
       <pub-location>Geneva, Switzerland</pub-location>
		 <isbn>978-3-95450-178-6</isbn>
		 <electronic-resource-num>10.18429/JACoW-SRF2015-MOPB095</electronic-resource-num>
		 <language>English</language>
		 <pages>373-377</pages>
       <pages>MOPB095</pages>
       <keywords>
          <keyword>cavity</keyword>
          <keyword>SRF</keyword>
          <keyword>linac</keyword>
          <keyword>controls</keyword>
          <keyword>operation</keyword>
       </keywords>
       <work-type>Contribution to a conference proceedings</work-type>
       <dates>
          <year>2015</year>
          <pub-dates>
             <date>2015-12</date>
          </pub-dates>
       </dates>
       <urls>
          <related-urls>
              <url>http://dx.doi.org/10.18429/JACoW-SRF2015-MOPB095</url>
              <url>http://srf2015.vrws.de/papers/mopb095.pdf</url>
          </related-urls>
       </urls>
       <abstract>
          In preparation of a rigorous superconducting RF (SRF) cavity processing and test plan for the production of the Facility for Rare Isotope Beams (FRIB) driver linac, a state-of-the-art chemical etching tool has been installed in the FRIB coldmass production facility. This paper seeks to summarize the etching equipment design, installation, and validation program and subsequent etching results for a variety of SRF cavity types and etching configurations. Bulk etching, light etching, and custom (frequency tuning) etching results for different FRIB cavities are discussed. Special emphasis is placed on the etching removal uniformity and frequency tuning reliability of these processes.
       </abstract>
    </record>
  </records>
</xml>
