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https://doi.org/10.18429/JACoW-IPAC2014-WEPME019
Title Heat Distribution Analysis of Planar Baluns for 1kW Solid-state Amplifiers and Power Combining for 1.8kW
Authors
  • T.-C. Yu, L.-H. Chang, M.H. Chang, L.J. Chen, F.-T. Chung, M.-C. Lin, Y.-H. Lin, Z.K. Liu, C.H. Lo, M.H. Tsai, Ch. Wang, T.-T. Yang, M.-S. Yeh
    NSRRC, Hsinchu, Taiwan
Abstract Solid-state transmitter for booster and storage ring in synchrotron would be composed of hundreds of amplifier modules. The amplifier module is biased at class AB and constructed in push-pull operation. Recent trend of amplifier module design features higher power up to 800 Watts and equipped planar balun (balance-unbalance converter) for push-pull operation. In NSRRC, the exclusive round planar design has encounter high temperature situation at kW range. Therefore, further study on this thermal condition is carried out in this study. Four types of planar balun design and two laminate materials are used for heat analysis. The typical coaxial balun is also applied on actual amplifier design. The results bring the better design with proper laminate choice and leads to acceptable thermal distribution with 1kW output power at 500MHz. Besides, for a more compact module with higher output power, the combination of two chips on the same circuit reaching 1.8kW is also presented.
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Conference IPAC2014, Dresden, Germany
Series International Particle Accelerator Conference (5th)
Proceedings Link to full IPAC2014 Proccedings
Session Poster Session, Messi Area
Date 18-Jun-14   16:00–18:00
Main Classification 07 Accelerator Technology Main Systems
Sub Classification T08 RF Power Sources
Keywords operation, impedance, storage-ring, booster, controls
Publisher JACoW Publishing, Geneva, Switzerland
Editors Christine Petit-Jean-Genaz (CERN, Geneva, Switzerland); Gianluigi Arduini (CERN, Geneva, Switzerland); Peter Michel (HZDR, Dresden, Germany); Volker RW Schaa (GSI, Darmstadt, Germany)
ISBN 978-3-95450-132-8
Published July 2014
Copyright
Copyright © 2014 by JACoW, Geneva, Switzerland     CC-BY Creative Commons License
cc Creative Commons Attribution 3.0